Polyamide
Elektrisola offers a wide range of polyamide self bonding wire adhesive types with different properties. In comparison to other types of bond coats, polyamide types show a high bonding strength. Furthermore, some of them also have high resoftening temperatures. However, some are hygroscopic and therefore difficult to use in hot and humid climate.
Enamel properties
| Chemical base of selfbonding enamel | Selfbonding type | Suitability of bonding methods | Recommended bonding conditions | Features | Applications | |||||
| Hot air | Oven | Solvent | Elec. current | Oven bonding temperature | Solvent type | |||||
| Polyamide | Polyamide | FS | ++ | ++ | ++ | ++ | 160°C | Ethanol, Methanol | All bonding methods applicable, good processability, hygroscopic | Loudspeakers, small motors, sensors, Transponders |
| Polyamide | HS | ++ | ++ | -- | ++ | 150-220°C | N/A | excellent hot air bonding type | voice coils (e.g. receiver), small motors, RFID coils, tag coils, optical pick up coils, spindle motors | |
| Polyamide | OS | ++ | ++ | -- | ++ | 140-200°C | N/A | very easy bonding, very high bonding strength | voice coils (e.g. receiver), small motors, RFID coils, tag coils, optical pick up coils, spindle motors | |
| Polyamide | PS | ++ | ++ | -- | ++ | 160°C | N/A | All purpose selfbonding enamel, wide process window, high bonding strength, thermosetting applicable, non-hygroscopic | Instrument coils, loudspeakers, vibration motors, sensors, receiver and speaker for mobile phones | |
Resoftening characteristics
Comparison of PS with and without Postbaking
Bonding characteristics
Hot air bonding characteristics
Solvent bonding
Oven bonding characteristics
