General
| Product-Code | AB15 | ABP15 | CBP15 | FS15 | FSP15 | PSP15 | HSP15 | FSP18 | STP18 | HSP18 | FS18 | HS18 | FS20 |
| Product-Name | Butybond AB15 | Butybond ABP15 | Butybond CBP15 | Solabond FS15 | Solabond FSP15 | Solabond PSP15 | Solabond HSP15 | Solabond FSP18 | Thermobond STP18 | Solabond HSP18 | Solabond FS18 | Solabond HS18 | Solabond FS20 |
| General Description | |||||||||||||
| Base coat | mod. Polyurethane | mod. Polyurethane | mod. Polyurethane | mod. Polyurethane | mod. Polyurethane | mod. Polyurethane | mod. Polyurethane | mod. Polyurethane | mod. Polyurethane | mod. Polyurethane | Polyesterimide | Polyesterimide | Theic-mod. Polyesterimide |
| Base coat type | P155 | P155p | P155p | P155 | P155p | P155p | P155p | P180 | P180 | P180 | E180 | E180 | A200 |
| Bond coat | Polyvinylbutyral | Polyvinylbutyral | Polyvinylbutyral | Polyamide | Polyamide | Polyamide | Polyamide | Polyamide | Polyamide | Polyamide | Polyamide | Polyamide | Polyamide |
| Bond coat type | AB | AB | CB | FS | FS | PS | HS | FS | ST | HS | FS | HS | FS |
| IEC (including the following norms) | IEC 60317-35, 60317-2 | IEC 60317-35, 60317-2 | IEC 60317-35, 60317-2 | IEC 60317-35, 60317-2 | IEC 60317-35, 60317-2 | IEC 60317-35, 60317-2 | IEC 60317-35, 60317-2 | IEC 60317-36 | IEC 60317-36 | IEC 60317-37 | |||
| NEMA (including the following norms) | MW 131-C | MW 131 | MW 131 | MW 131 | MW 131 | MW 131 | MW 131 | MW 131 | |||||
| Diameters available | 0.01 - 0.50 mm | 0.01 - 0.50 mm | 0.01 - 0.50 mm | 0.01 - 0.50 mm | 0.01 - 0.50 mm | 0.01 - 0.50 mm | 0.01 - 0.50 mm | 0.01 - 0.50 mm | 0.01 - 0.50 mm | 0.01 - 0.50 mm | 0.01 - 0.50 mm | 0.01 - 0.50mm | 0.01 - 0.50 mm |
| Properties | Low bonding temperature, wide process window, non-hygroscopic | Low bonding temperature, wide process window, non-hygroscopic, low priced | Solvent bonding type, fast drying, excellent solderability, pinhole free | All bonding methods applicable, good processability, hygroscopic (not suited for humid regions) | All bonding methods applicable, good processability, hygroscopic | All purpose selfbonding enamel, wide process window, high bonding strength, thermosetting applicable, non-hygroscopic | High resoftening temperature, excellent solderability, pinhole free | All bonding methods applicable, good processability, hygroscopic | Good winding ability, thermosetting applicable | High resoftening temperature, good solderability, increased themal and mechanical properties of base coat, pinhole free | Solvent bonding possible, high resoftening temperature, high thermal and mechanical properties of base coat, hygroscopic thus not suitable for Asia | High resoftening temperature, good solderability, high themal and mechanical properties of base coat | All bonding methods applicable, good processability, hygroscopic |
| Storage in months (at 25 degrees Celsius / 60% relative humidity) | ≤ 6 | ≤ 6 | ≤ 6 | ≤ 3 (hygroscopic) | ≤ 3 (hygroscopic) | ≤ 6 | ≤ 6 | ≤ 5 (hygroscopic) | ≤ 6 | ≤ 6 | ≤ 5 (hygroscopic) | ≤ 6 | ≤ 5 (hygroscopic) |
| Applications | Stepping motors for quartz watches, instrument coils, voice coils, Sensors, Transponders | Stepping motors in quartz watches, instruments, voice coils, sensors, RFID and Transponders | Stepping motors for quarz watches, instrument coils, voice coils, sensors | Loudspeakers, small motors, sensors, Transponders | Loudspeakers, small motors, sensors, Transponders | Instrument coils, loudspeakers, vibration motors, sensors, receiver and speaker for mobile phones | Instrument coils, loudspeakers, small motors, sensors | Loudspeakers, small motors, sensors, Transponders | High power speaker, vibration motors | Instrument coils, loudspeakers, small motors, sensors, transponders | Loudspeakers, small motors, sensors, Transponders | Small motors, loudspeakers | Loudspeakers, small motors, sensors, Transponders |