General

Product-Code
AB15
ABP15
CBP15
FS15
FSP15
PSP15
HSP15
FSP18
STP18
HSP18
FS18
HS18
FS20
 
Product-NameButybond AB15Butybond ABP15Butybond CBP15Solabond FS15Solabond FSP15Solabond PSP15Solabond HSP15Solabond FSP18Thermobond STP18Solabond HSP18Solabond FS18Solabond HS18Solabond FS20
 
General Description
   Base coatmod. Polyurethanemod. Polyurethanemod. Polyurethanemod. Polyurethanemod. Polyurethanemod. Polyurethanemod. Polyurethanemod. Polyurethanemod. Polyurethanemod. PolyurethanePolyesterimidePolyesterimideTheic-mod. Polyesterimide
   Base coat typeP155P155pP155pP155P155pP155pP155pP180P180P180E180E180A200
   Bond coatPolyvinylbutyralPolyvinylbutyralPolyvinylbutyralPolyamidePolyamidePolyamidePolyamidePolyamidePolyamidePolyamidePolyamidePolyamidePolyamide
   Bond coat typeABABCBFSFSPSHSFSSTHSFSHSFS
 
IEC (including the following norms)IEC 60317-35, 60317-2IEC 60317-35, 60317-2IEC 60317-35, 60317-2IEC 60317-35, 60317-2IEC 60317-35, 60317-2IEC 60317-35, 60317-2IEC 60317-35, 60317-2IEC 60317-36IEC 60317-36IEC 60317-37
 
NEMA (including the following norms)MW 131MW 131MW 131MW 131MW 131MW 131MW 131MW 131
 
Diameters available0.01 - 0.50 mm0.01 - 0.50 mm0.01 - 0.50 mm0.01 - 0.50 mm0.01 - 0.50 mm0.01 - 0.50 mm0.01 - 0.50 mm0.01 - 0.50 mm0.01 - 0.50 mm0.01 - 0.50 mm0.01 - 0.50 mm0.01 - 0.50mm0.01 - 0.50 mm
 
PropertiesLow bonding temperature, wide process window, non-hygroscopic, low pricedLow bonding temperature, wide process window, non-hygroscopic, low pricedSolvent bonding type, fast drying, excellent solderability, pinhole freeAll bonding methods applicable, good processability, hygroscopic (not suited for humid regions)All bonding methods applicable, good processability, hygroscopicAll purpose selfbonding enamel, wide process window, high bonding strength, thermosetting applicable, non-hygroscopicHigh resoftening temperature, excellent solderability, pinhole freeAll bonding methods applicable, good processability, hygroscopicGood winding ability, thermosetting applicableHigh resoftening temperature, good solderability, increased themal and mechanical properties of base coat, pinhole freeSolvent bonding possible, high resoftening temperature, high thermal and mechanical properties of base coat, hygroscopic thus not suitable for AsiaHigh resoftening temperature, good solderability, high themal and mechanical properties of base coatAll bonding methods applicable, good processability, hygroscopic
 
Storage in months (at 25 degrees Celsius /
60% relative humidity)
≤ 6≤ 6≤ 6≤ 3 (hygroscopic)≤ 3 (hygroscopic)≤ 6≤ 6≤ 5 (hygroscopic)≤ 6≤ 6≤ 5 (hygroscopic)≤ 6≤ 5 (hygroscopic)
 
ApplicationsStepping motors in quartz watches, instruments, voice coils, sensors, RFID and TranspondersStepping motors in quartz watches, instruments, voice coils, sensors, RFID and TranspondersStepping motors for quarz watches, instrument coils, voice coils, sensorsLoudspeakers, small motors, sensors, TranspondersLoudspeakers, small motors, sensors, TranspondersInstrument coils, loudspeakers, vibration motors, sensors, receiver and speaker for mobile phones Instrument coils, loudspeakers, small motors, sensorsLoudspeakers, small motors, sensors, TranspondersHigh power speaker, vibration motors Instrument coils, loudspeakers, small motors, sensors, transpondersLoudspeakers, small motors, sensors, TranspondersSmall motors, loudspeakersLoudspeakers, small motors, sensors, Transponders
 

 

 

   Thermal Values of Base Coat

   Electrical Values

   Mechanical Values

   Bonding of Wire

   Solderability